ROHM has developed a wireless power receiver IC designed to charge smartphones and other portable devices. The BD57011GWL is compliant with WPC’s (Wireless Power Consortium) latest Qi Low Power Ver1.1 standard for wireless power transmission. The IC features low heat generation in a monolithic design, reducing temperature rise by up to 75% during wireless charging. The device claims to feature the industry’s first misalignment detection function detects incorrect positioning of the target device on the charging pad, which can lead to decreased charging efficiency.
The series includes the FDMC86261P 150 V and the FDMC86139P 100 V P-channel MOSFETs. The P-channel MOSFETs claim to provide an improved switching performance figure of merit (FOM) 67 percent better than the best competitor part. Conduction losses are also improved by 46 percent and switching losses are improved by 38 percent. The devices allow designers to shrink the footprint and improve overall system performance.
Farnell element14 has launched the newest low-power, low-cost device in the PSoC 1 family from Cypress Semiconductor Corp. The exclusive kit features Cypress’ CY8C24x93 low-power PSoC1 and brings the power of PSoC to life in an ultra low-power and low-pin count configuration. Priced at £14.52, it is available from Farnell element14 in Europe.
Packed with a range of features and interfaces the kit enables streamlined and cost-efficient designs, and include thermistor and humidity analog sensors, 4 Segment LCD, IR LED for remote control, power and data logging through full speed USB 2.0, onboard programmer, potentiometer and accessible open GPIO pins. The device is ideal for battery or handheld applications; with its 1.1mA current draw in Active mode, 1.07 µA in Standby mode, and 100nA in Deep Sleep mode with the ability to wake up from an interrupt.
XP Power has released the company’s dual output EMH350 series of 350 Watt AC-DC power supplies aimed at a broad range of applications that require a dual output supply in an industry standard 4 x 6 inch footprint. The units, which are typically 87% efficient, provide two outputs rated up to 200 W each with a combined maximum output of 350 W.
The series comprises five different models with a combination of six different output voltages from 12 to 60 VDC. Outputs are also capable of being connected in series in order to provide a single output up to 120 VDC. All models include an additional 12 V / 0.6 A fan output and a 5 V / 2 A standby output. Signal and control functions include AC OK/power fail, inhibit, current share and remote sense.
Toshiba Electronics Europe (TEE) has unveiled two ultra-compact MOSFETs in high power dissipation packages that have been specifically developed to meet the high-current charging requirements of the latest mobile devices.
The SSM6K781G N-channel and SSM6J771G P-channel MOSFETs are each supplied in a miniature 1.5 mm x 1.0 mm wafer level chip scale package (WCSP6C) package that is rated for power dissipation (PD) of up to 1.2 W. The WCSP6C package is the optimum choice in applications with minimum available board space, as the ratio between size and power handling capability of the WCSP6C package is superior in comparison to mold type packages. This makes the MOSFETs ideal for power switching in charging circuits for the latest tablets, mobile phones and other space-constrained portable devices where hpagigh currents are required to minimise charge times.