PICMG ratifies IoT.1 spec for IoT smart sensors
PICMG has ratified its first firmware specification defining a communication standard between sensors / effecters and local IoT controllers such as micro Sensor Adapter Modules (microSAM) already specified by PICMGs IoT.0 specification.
The IoT.1 specification defines a firmware interface and low-level data model that provides for vendor-independent configuration of smart sensors and effecters, as well as plug and play interoperability with higher levels of the installation. IIoT.1 supports both sensing and profiled motion control required by most emerging Industry 4.0 applications.
This is intended to accelerate the uptake of smart-sensor technology through open-specifications and interoperability
Related articles
- PICMG ratifies MicroSAM module format for smart sensors
- congatec’s Type 7 server-on-modules are now PICMG standard
The IoT.1 specification is the first work product from PICMG based on collaboration with the DMTF organization. PICMG’s IoT.1 specification leverages and extends the Platform Level Data Model (PLDM) specification from Distributed Management Task Force (DMTF) in order to address the needs of industrial automation and control. PLDM is a low level messaging system that supports topologies, eventing and discovery and runs over a variety of system level buses such as I2C/SMBus and PCIeVDM (Vendor-Defined Message) over MCTP (Management Component Transport Protocol) as well as RBT (RMII-Based Transport (RMII = Reduced Media Independent Interface)) over NC-SI (Network Controller Sideband Interface).
IoT.1 was developed to enable sensor vendors to create smart sensors without having to manufacture the control circuitry and/or software by purchasing these components from PICMG-compliant suppliers. It enables controller suppliers who wish to create smart sensors or smart-sensor components to do so in a way that is interoperable with other suppliers and integrate sensors/effecters from multiple vendors with controllers from multiple vendors.
When combined with the PICMG sensor-domain network architecture and data model, sensors connected to MicroSAMs (PICMG IoT.0) or other controller modules will seamlessly integrate into the network with plug-and-play interoperability.
“Nothing like this has ever been done before in Industrial IoT – PICMG IoT.1 brings true multi-vendor plug and play interoperability to the sensor/effecter domain with flexible, open-standards based solutions,” said Doug Sandy, CTO of PICMG.
IoT.1 was developed in collaboration with Arroyo Technology, nVent, Triple Ring Technologies, Sandy Systems as part of the PICMG group.
www.picmg.org/industrial-iot-overview/
Other articles on eeNews Europe
- Stratasys acquires Xaar’s 3D printing joint venture
- Infineon boosts capex by 50 percent to €2.4bn
- Extra keynotes for DVcon Europe
- 65GHz cable and board interconnect boost
- NeuroBlade raises $83m for compute in memory chip
- Intel backs RISC-V for Nios FPGA processor
- II-VI boosts production at UK fab
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
