The high aspect ratio design enables ATS Pin Fin heat sinks to provide low thermal resistance from base to fins in systems where the airflow measures 200-plus LFM (linear feet per minute). The cross-cut design also allows the Pin Fin heat sinks to be effective in systems where the airflow is ambiguous. The heatsinks are made from extruded aluminium and are available in component sizes from 10 mm by 10 mm to 60 mm to 60 mm. Heat sink heights range from 2 mm to 25 mm.
At higher airflows, these Pin Fin Heat Sinks can provide thermal resistance as low as 2.5°C/W without adding significant cost or weight to the design. Custom and standard solutions are available and all are suitable for limited-space designs. The heatsinks can be attached with standard thermal tape or with ATS’ ‘clipKIT’, featuring either ‘maxiGRIP’ or ‘superGRIP’ two-component mechanical attachment systems that securely mount a heat sink to a component without needing to drill holes and with minimal additional footprint. Pin Fin heat sinks can be used for a variety of packages from BGA to LGA to TSOP and more.