Planar Schottky diode in space-saving CFP3-HP packaging
Nexperia has launched a portfolio of 11 planar Schottky diodes in CFP3-HP packaging for automotive designs.
The CFP3-HP package developed by Nexperia has an exposed heatsink that enables high levels of heat dissipation in the 3.7 mm x 1.8 mm x 0.9 mm package footprint.
This supports the growing trend for manufacturers to replace devices in SMx-type packaging with smaller footprint CFP-packaged devices, especially in automotive applications. These diodes are suitable for use in, for example, DC-DC conversion, freewheeling, reverse polarity protection and OR-ing applications.
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The packages use Nexperia’s proprietary copper clip design and are used by different power diode technologies such as Nexperia’s Schottky and recovery rectifiers but can also be extended to bipolar transistors.
For maximum design flexibility, device options in this portfolio are offered with reverse voltages VR(max) ranging from 30 V to 100 V and forward currents IF(average) between 1 A and 3 A.
“As the industry transitions to smaller packages like CFP, Nexperia is committed to actively contributing to this shift, reinforcing our dedication to packaging innovation,” said Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia.
“With substantial investments in capacity expansion, we are poised to meet the increasing demand for CFP-packaged products, surpassing market expectations for the next three years. These diodes mark the latest additions to our extensive portfolio of over 270 CFP-packaged products.”
There are also 11 industrial versions of the Schottky diodes in the CFP3-HP packaging.
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