Planar Schottky diodes in space-saving CFP2-HP packaging
Nexperia is offering a portfolio of 16 planar Schottky diodes in thermally optimised CFP2-HP packaging.
The range includes eight AEC-Q101 qualified devices as well as eight for industrial. The devices are aimed at manufacturers replacing devices in SMA/B/C type packaging with smaller footprint CFP-packaged devices, especially in automotive applications.
These diodes are suitable for use in DC-DC conversion, freewheeling, reverse polarity protection and OR-ing applications.
The copper clip design of the CFP packaging is used by different power diode technologies such as Nexperia’s Schottky and Recovery Rectifier Diodes and will also be extended to bipolar transistors.
For maximum design flexibility, this portfolio extension offers reverse voltages VR(max) ranging from 20 V to 60 V and forward currents IF(average) of 1 A and 2 A. The exposed heatsink of the CFP2-HP enables the highest level of heat dissipation (Ptot) at a small package footprint. The CFP2-HP package dimensions are 2.65 mm x 1.3 mm x 0.68 mm including the leads.
“As the industry transitions to multi-layer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging becomes a crucial part of the thermal system. Smaller packages like CFP, which offer more efficient heat dissipation, are a core part of Nexperia’s commitment to actively contribute to this shift,” says Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia.
“Modern CFP packaging technology, designed for multilayer PCBs, offers equal electrical performance on a smaller footprint, reducing part and system costs. With substantial investments in capacity expansion, we are poised to meet the increasing demand for CFP-packaged products. They are essential for future-proofing automotive and industrial applications against the rising demands and ensuring competitiveness in the market.”
A low IR optimized portfolio of planar Schottky diodes for automotive and industrial applications will be released in May.
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