Plans for TSMC’s Hsinchu 2nm wafer fab discussed
The details of the meeting held online were reported by Taiwan’s Commercial Times.
The Hsinchu Science Park Baoshan Land Expansion Project Phase II is considering the environmental impact and mitigation activities for an expansion of Baoshon to provide for expansion of TSMC’s 2nm manufacturing capacity.
The total area of Baoshan Phase II is 90.02 hectares. The construction is expected to start after the land acquisition is completed and the total construction period is estimated to be 60 months.
The meeting paid attention to environmental impact assessment, water reclamation and protection of the Keya River restoration zone.
Related links and articles:
Fateful Choices For ICs and Taiwan
TSMC starts 2021 with strong sales growth
Intel seeks $10 billion subsidy for ‘EuroFab’
TSMC’s $100bn fab plans to expand capacity
Samsung planning $10 billion 3nm fab in Texas
TSMC hiring for Arizona wafer fab
TSMC approves $3.5 billion spending for Arizona fab
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
