Plessey and Axus Technology partner on GaN-on-Silicon microLEDs
A number of Axus CMP and Scrubber systems have been deployed to enable critical wafer planarisation and preparation for wafer-scale bonding. Wafer-level bonding poses significant technical challenges and even with the right equipment requires extensive know-how and refined processes. Shortly after installation of the systems in 2019, Plessey achieved the world’s first functional wafer-level bonded GaN-on-Si monolithic 1080p 0.7” diagonal 8-micron pixel-pitch microLED active-matrix display.
Plessey has further optimised these systems and processes to achieve a successful wafer to wafer bond of a much smaller monochrome native Green 1080p microLED display 0.26” diagonal to a 3-micron pixel-pitch backplane display system engineered by Compound Photonics, creating over two million individual electrical bonds.
The formation of the Plessey/Axus partnership has led to the development of critical CMP processes for various materials key to enabling Plessey’s proprietary monolithic GaN-on-Si technology. Engineers from both companies have collaborated to successfully accomplish these objectives at both Axus’ CMP foundry located in Chandler, Arizona and Plessey’s semiconductor fabrication facility in the United Kingdom.
Going forward, the partnership will support scaling the technology for high-volume manufacture on the existing Axus equipment set and in the near future Axus’ new state-of-the-art, high flexibility/throughput Capstone CMP System, released to the market late 2019.
“With our innovative approach and determination these tool platforms are enabling Plessey to advance its world-leading proprietary GaN on Silicon monolithic microLED technology. Our ever-expanding investment in our manufacturing facility in the UK is allowing Plessey to innovate rapidly and deliver leading-edge technology for AR and other display applications”, said Mike Snaith, Chief Operating Officer at Plessey.
Plessey – www.plesseysemi.com
Axus Technology – www.axustech.com
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