Plessey focuses on chip scale application specific LEDs

Plessey focuses on chip scale application specific LEDs
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Plessey has expanded into chip scale packages and wafer level packaging solutions with the company's introduction of the AS-LED Application Specific LED.
By eeNews Europe

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Recent performance improvements have elevated Plessey’s GaN-on-Silicon technology MaGIC LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevating GaN-on-Silicon above existing LED technology.

Dr. Keith Strickland, Plessey CTO, said: "Our most recent advancements in performance to greater than 50% wall plug efficiency coupled with our unique semiconductor technologies and manufacturing capabilities have pushed us to our next stage of technology development. We are now looking at chip scale and wafer level packaging capabilities and technologies. We will have our first chip scale package solution available for sampling later this quarter. We need to move the conversation from lumens/watt to how the semiconductor industry can provide the capability for mass customisation needed for the solid state lighting industry. Our LED components are more than competitive with any sapphire or silicon carbide solution, but the industry needs far more. We believe our AS-LED provides the solution to the mass customisation needed in the solid state lighting markets."

Plessey’s MaGIC (Manufactured on GaN-on-Si I/C) High Brightness LED (HBLED) technology has won numerous awards for its innovation and ability to cut the cost of LED lighting by using standard silicon manufacturing techniques.

Plessey’s range of products for lighting applications will be showcased at LuxLive, ExCel London, 19-20 November, Stand D31.  

www.plesseysemi.com

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