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POD cable assemblies target high-speed data and computer applications

POD cable assemblies target high-speed data and computer applications

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By eeNews Europe



The assemblies are the first on the market to meet Telcordia GR-1435 environmental specifications required by telecommunications equipment providers, and are available in both a 1.80 mm jacketed round version, in addition to the bare ribbon-fibre versions.

The VersaBeam POD cable assemblies feature a unique perpendicular mating capability to provide optimum airflow and ribbon cable management, as well as increase real-estate opportunities on dense printed circuit boards (PCBs).

The VersaBeam POD Cable Assemblies are interconnected through the Molex extensive line of front-panel and blind-mating optical backplane connectors, providing customers with the widest selection of high-density interconnects for a variety of system architecture designs. By using 24-, 48- and 72-fibre MT ferrules, the POD cable assemblies can be mated to the Molex high density interconnects including HBMT, array connector and circular MT connectors.

Visit Molex at www.molex.com/link/versabeampod.html

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