Power modules help designers to scale EV designs

Power modules help designers to scale EV designs

New Products |
By Christoph Hammerschmidt

All new HybridPACK Drive power modules have the same footprint as the already introduced and established module (FS820R08A6P2x) of this product family. This allows system developers to scale inverter performance quickly and easily without having to make significant changes to the system design.

In the area of moderate performance, the new HybridPACK Drive Flat (FS660R08A6P2Fx) and Wave (FS770R08A6P2x) modules as part of the product family are cost-optimized solutions for inverters with an output of 100 to 150 kW. Their base plates for the connection to the cooling element of the inverter have different structures with different heat dissipation. In contrast to the established Pin-Fin base plate with the highest cooling capacity, the flat version uses a very flat one without special thermal structures. This leads to a somewhat reduced performance range, but also to lower costs. With a ribbon-bond structure on the base plate, the wave version offers performance between the flat and pin fin versions.

At the top of the portfolio is the HybridPACK Drive Performance (FS950R08A6P2B) module for 200 kW inverters. Like the previous flagship product, it has a pin fin base plate. However, instead of the usual aluminum oxide, a special ceramic material is used here, which improves heat dissipation by more than 20 percent and thus enables higher currents. Like the flat and wave versions, the performance version is also based on the EDT2 (Electric Drive Train) IGBT generation of the originally introduced module, with the correspondingly high electrical functionality of the chipset.

The fourth new family member (FS380R12A6T4x) is a variant of the performance module with an output of 150 kW. While the Pin-Fin base plate with the new ceramic is also used here, a chipset with IGBT4 chips is used. The module thus offers a reverse voltage of 1200 V. This is particularly necessary for electric vehicles that are designed for particularly fast charging with a battery voltage of 700 V or more. Thus, the IGBT4 represents a cost-effective alternative to SiC modules for switching frequencies in the range of 8 kHz.

The company now also equips HybridPACK DSC modules with EDT2 technology (HybridPACK DSC S2, FF450R08A03P2). The chipset with a reverse voltage of 750 volts offers high current density, high short-circuit robustness and reduced losses at low loads. In addition, the new DSC S2 product, which utilizes the proven double-sided cooling package technology, is specified for increased short-time chip operating temperature up to 175°C. The DSC S2 product is designed to provide a high level of protection against short-circuits and reduced losses at low loads.

With the upgrade, the module’s performance can be increased by 40 percent compared to the HybridPACK DSC S1 with the same footprint. In addition, a very high power density is achieved, which benefits developers of hybrid and plug-in hybrid inverters in view of the limited space available.

As a compact half-bridge module, the HybridPACK DSC enables different inverter geometries and offers the possibility of further integration of the inverter into the motor. The current and temperature sensors integrated in the chip contribute to efficient and safe inverter operation.

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