
Press-Fit terminal power modules for a solder-free assembly
Microchip Technology has added press-fit terminals to its range of SP1F and SP3F power modules for high-volume applications.
The high accuracy of the terminal locations and the novel Press-Fit pin design in the Microchip SP1F and SP3F power modules enables high-reliability contact with the printed circuit card.
Press-Fit terminals are often used to improve the installation process with robots as they offer a solder-free process to mount power modules to the PCB, which simplifies and speeds up assembly to reduce manufacturing costs. This means a Press-Fit power modules can save valuable time and production costs.
There are over 200 variants available in Microchip’s SP1F and SP3F power modules portfolio, with options to use mSiC technology or silicon semiconductors and an array of topologies and ratings. The SP1F and SP3F are offered in voltage range of 600V-1700V and up to 280A.
With Press-Fit technology, the power module pins are not soldered to the PCB. Instead, the electrical connection is made by pressing the pins into properly sized PCB holes. A key advantage of a Press-Fit power module solution is it eliminates the need for wave soldering. This is especially important when the PCB is made to also include Surface-Mount Technology (SMT) components.
“Our power modules with Press-Fit terminals offer customers the flexibility to fully customize their design and are cost-effective power solutions for high-volume production,” said Leon Gross, vice president of Microchip’s discrete products group. “This type of plug-and-play power solution also provides a highly reliable mounting solution for automated or robotic assembly.”
Application note AN4322 provides detailed mounting instructions for SP1F and SP3F Press-Fit power modules.
The highly configurable SP1F and SP3F power modules are fully compliant with the Restriction of Hazardous Substances Directive (RoHS) and are available now.
