Proposals sought for flexible hybrid electronics advances for IoT
SEMI-FlexTech, in partnership with the U.S Army Research Laboratories (ARL), is seeking proposals for projects that advance heterogeneous packaging for FHE including integrated systems, system architecture and design, and integrated power management components such as batteries, supercapacitors, and energy harvesting. SEMI-FlexTech plans to announce multiple awards to teams or organizations with research and development capability in the U.S.
“This solicitation emphasizes FHE for the Internet of Things (IoT) as we seek to advance the state of the art and incorporate thinned ICs, flexible and printed electronics, power, and sensors into a flexible, conformal, low-power package,” says Melissa Grupen-Shemansky, Executive Director and CTO of SEMI-FlexTech. “The SEMI-FlexTech program is designed to engage multi-disciplinary teams from across the supply chain to develop creative solutions that accelerate the introduction of new FHE technologies.”
SEMI-FlexTech’s Technical Council will evaluate and rank proposals, prioritize and manage projects, and administer funding. Grant recipients must match the fund award with cash and in-kind contributions to cover total project cost. A product demonstration is also required for award consideration.
SEMI-FlexTech says it will fund technical approaches that are revolutionary or carry high risk, as well as lower-risk evolutionary approaches with shorter development and delivery timetables. SEMI-FlexTech funds research and development initiatives that fall within the U.S. government’s Technology Readiness Levels (TRLs) 3-6 and Manufacturing Readiness Levels (MRLs) 1-3.
White paper proposals are due July 9, 2018, at 5:00 PM PDT. Review the full Request for Proposal (RFP) for more information about the submission process here.
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