MENU

PSMC selects Miyagi site for Japanese wafer fab

PSMC selects Miyagi site for Japanese wafer fab

Business news |
By Peter Clarke



Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) has selected the Miyagi prefecture as the location for a 300mm wafer fab that could be in operation in 2026.

It was revealed that PSMC was looking to build a fab in Japan in July (see PSMC to create 300mm wafer fab in Japan). The planned budget is 800 billion yen ($5.3 billion) with the first phase of the project requiring a 420 billion yen investment. PSMC and SBI Holdings will pay for about half of the cost of the foundry, with the rest coming from foreign and domestic investors, and government subsidies, the companies said.

PSMC is working with finance company SBI Holdings Inc. in a move that is part of Japan’s effort to strengthen its semiconductor supply chain, PSMC said. Construction is expected to start in 2024.

PSMC offers a variety of manufacturing process technologies behind the leading-edge including logic, DRAM and flash memory, PMICs, CMOS image sensors, and high-voltage circuits. It is Taiwan’s third largest foundry behind TSMC and UMC.

In July Frank Huang, chairman of PSMC, said his company would help strengthen Japan’s domestic IC supply chain, by developing 22nm and 28nm and higher process technologies and wafer-on-wafer 3D stacking technology.

It was also reported that PSMC hopes to get up to 40 percent of the cost of building its wafer fab from Japanese government initiatives to re-invigorate its chip industry.

Related links and articles:

www.powerchip.com

News articles:

PSMC to create 300mm wafer fab in Japan

Taiwan foundry in talks over Indian wafer fab

Japan to provide 40 percent subsidy to TSMC, Sony venture

Top ten foundries saw 1Q23 revenue drop, rankings change

Rapidus seeks billions of dollars to use IBM’s 2nm process

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News

Share:

Linked Articles
10s