Qi compliant wireless power receiver IC reduces heat generation by 30 percent
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By
eeNews Europe
ICs used in mobile applications including smartphones, are required to generate heat at low level, to prevent overheating. The TC7761WBG is fabricated with a combined CMOS-DMOS wafer process that cuts heat generation to 70% that of an equivalent product[2] while achieving 95% power conversion efficiency. The IC’s built-in protocol authentication circuit, includes a foreign object detection (FOD) function, eliminates the need for an external microcontroller and contributes to simplified system designs.
TC7761WBG has been Qi certified for an output power of 3.5 W, and can handle a maximum output power of 5W. Shipments of mass produced chips are now available to buy.
Visit Toshiba at www.toshiba-components.com
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