Qseven module based on AMD Fusion G-series APUs in a 70x70mm format

Qseven module based on AMD Fusion G-series APUs in a 70x70mm format

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By eeNews Europe

The H6059 module is well suited for embedded applications that require powerful CPU and graphics performance in combination with low power consumption and extremely compact size. The Radeon 6250 GPU is integrated with the CPU to offer for instance increased 2D/3D and motion video acceleration performance and can be used for general purpose GPU computing (GPGPU) by taking advantage of AMD’s Open CL support. An on-die GPU such as this has advantages over discrete GPUs by avoiding the memory bus bottleneck. H6059 targets applications such as digital signage solutions, high-end HMIs, portable test and measurement applications as well as imaging and vision systems based on for instance high-end cameras.

Other features includes a rich set of I/O interfaces including for example four PCI Express ports, eight USB 2.0 ports, two SATA ports, LVDS and the new digital display interfaces, DVl, HDMI and DisplayPort, as well as an onboard Intel 82583 Gigabit Ethernet Controller. Legacy I/O is supported through the LPC bus and the module has BIOS support for Super I/O devices on the carrier board. The module supports up to 4GB onboard soldered DDRIII DRAM, as well as an onboard soldered BGA SATA Flash SSD of up to 32GB. Hectronic has developed the BIOS for the module based on the new Phoenix SecureCore Tiano UEFI BIOS, and will also provide BSPs for XP Embedded, Windows Embedded Standard 7 and Linux.

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