QSMP-25 module integrates STM32 MPU for edge AI
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Direct Insight has introduced the QSMP-25, a compact 29 mm² QFN-style solder-down system-on-module (SoM) built around STMicroelectronics’ second-generation STM32MP255F microprocessor. The QSMP-25 STM32 MPU module combines dual ARM Cortex-A35 processors with a Cortex-M33 microcontroller, integrated NPU and GPU, making it suited to secure edge AI, advanced multimedia, and industrial IoT applications.
For eeNews Europe readers, this development is relevant to designs where footprint, EMI compliance, and long-term industrial-grade operation are critical. Its solder-down form factor and comprehensive peripheral support aim to simplify layout while meeting demanding Industry 4.0 and edge-computing requirements.
Hardware features for high-performance edge processing
The QSMP-25 offers dual 1.5 GHz Cortex-A35 cores alongside a 400 MHz Cortex-M33 MCU, a 1.24 TOPS NPU for AI/ML workloads, and an integrated GPU with HD video capabilities at 60 fps. Dual MIPI-CSI camera inputs enable high-resolution imaging, while on-module memory includes 1 GB LPDDR4 RAM and 4 GB eMMC storage.
The SoM measures 29 x 29 mm, is 2.6 mm high, and operates from a single 3.3 V supply. A full industrial temperature range from –40°C to +85°C is supported. The design is optimised for EMC performance, thermal efficiency, and cost, making it suitable for space-constrained and rugged environments.
Connectivity and security for Industry 4.0
Interface options include dual USB 2.0 (or USB 2.0 plus USB 3.0), PCIe, and dual Gigabit Ethernet, as well as UART, I²C, SPI, PWM, SAI, and three CAN channels. Security features address IoT and industrial use cases, enabling CRA-compliant system implementations.
The QSMP-25 STM32 MPU module is supplied with a dedicated Yocto Scarthgap build that includes a mainline Linux kernel, full sources, toolchain, and documentation. According to Direct Insight, this software support is intended to reduce time-to-market and ensure long-term maintainability.
David Pashley, co-founder and Managing Director at Direct Insight, said: “This new QSMP-25 solder-down module delivers an industrial-grade 64-bit solution for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities. Incorporating high-performance connectivity, multimedia, and display, with a Yocto-build mainline Linux BSP, this SoM simplifies design and production, with its QFN solder-down package optimising size and price, while simplifying PCB layout and EMI compliance.”
The QSMP-25 is manufactured by Ka-Ro Electronics, Direct Insight’s long-standing partner, and is available now with development kits and full technical documentation.
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