Qualcomm launches RF joint venture aimed at 5G
RF360 will deliver RF front end modules and RF filters for use in mobile devices, automotive systems and the Internet of Things (IoT). The two parents said that as well as operating the joint venture they will deepen technical cooperation between themselves on technologies for next-generation mobile communications, IoT and automotive applications.
As announced in January 2016, initially Qualcomm Global Trading Pte. Ltd. will own 51 percent of RF360 Holdings and TDK subsidiary Epcos AG will own 49 percent. Qualcomm has an option to acquire (and EPCOS has an option to sell) the remaining interest in the joint venture 30 months after the closing date.
Coming from the TDK-side of the deal RF360 Holdings will offer surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) filters to support the wide range of frequency bands being deployed in networks across the globe. From Qualcomm RF360 Holdings will offer RF front-end modules that include components designed and developed by Qualcomm including CMOS, SOI and GaAS power amplifiers, RF switching, antenna tuning and power envelope tracking chips.
“The ongoing expansion of mobile communication across multiple industries, and the unprecedented deployment of multi-carrier 4G technologies now reaching over sixty-five 3GPP frequency bands are driving manufacturers of wireless solutions to higher levels of miniaturization, integration and performance, especially for the RFFE in these devices,” said Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and president, QCT. “Further, 5G will increase the level of complexity even more. To that end, the ability to provide the ecosystem a truly complete solution is essential to enabling our customers to deliver mobile solutions at scale and on time.”
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