Quectel Matter over Thread modules for smart home interoperability
Quectel Wireless Solutions has introduced its KGM133S Matter over Thread modules, aimed at improving interoperability across mainstream smart home ecosystems. The modules combine Thread connectivity with support for the latest Matter 1.4 specification and additional Zigbee and Bluetooth LE options. Positioned for door locks, sensors, lighting and other household devices, the KGM133S series is intended to help equipment makers reduce protocol complexity and address fragmentation in connected-home designs.
For eeNews Europe readers, this is potentially relevant because Matter over Thread modules such as the KGM133S could influence how European OEMs architect low-power nodes, choose radio front-ends and plan IP-based connectivity in multi-ecosystem smart home products.
Matter over Thread modules built on Silicon Labs platform
The KGM133S series is based on Silicon Labs’ EFR32MG24 platform and supports Matter 1.4 over Thread, with the aim of providing IP-based connectivity into ecosystems including Apple Home, Google Home, Amazon Alexa and Samsung SmartThings. According to Quectel, the combination of Thread and Matter is intended to reduce the need for proprietary gateways, since Thread nodes can connect via a Border Router, potentially lowering latency and simplifying network topology.
Each module integrates 256 KB SRAM and a choice of Flash capacities, 1.5 MB, 2.5 MB or 3.5 MB, to accommodate current firmware requirements and anticipated Matter feature updates. An Arm Cortex-M33 core running up to 78 MHz handles protocol stacks and application code, which may be useful where vendors want to consolidate multiple functions on a single radio SoC.
Quectel highlights a compact LGA package in two footprints, 12.5 × 13.2 × 2.2 mm with IPEX or pin antenna options, and 12.5 × 16.6 × 2.2 mm with an onboard PCB antenna. Up to 26 GPIOs can be configured as I²C, UART, SPI or I²S, giving designers some flexibility when interfacing sensors, actuators or audio subsystems.
Targeting low-power, secure smart home nodes
Thread-based low-power operation is a central design goal, with the KGM133S aimed at battery-powered endpoints that must still maintain mesh connectivity. The RF section is specified with a receive sensitivity better than –105 dBm and an optional transmit power up to 19.5 dBm, which could help maintain link robustness in European homes with concrete walls or dense device deployments. An operating temperature range from –40 to +105 °C positions the modules for use beyond indoor hubs, for example in outdoor lighting or exposed sensors.
In addition to Matter over Thread, the KGM133S series also supports Zigbee 3.0 and Bluetooth LE 6.0, which may be useful for bridging legacy products or adding commissioning and control features via smartphones. Secure Vault enhanced security is included from the underlying Silicon Labs platform, giving manufacturers a hardware-assisted path to protect credentials and user data in connected-home deployments.
“Protocol fragmentation remains one of the biggest obstacles to seamless smart device connectivity, and the Matter protocol is the key to overcoming it,” said Delbert Sun, Deputy General Manager at Quectel Wireless Solutions. “With our new Matter over Thread modules, we are helping the industry achieve true interoperability.”
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