The single-chip SoC R-Car E3 combines 3D graphics playback functions with integrated audio DSP and other peripheral functions. The SoC thus supports combination instruments and IVI (in-vehicle infotainment) systems with audio display and other functions.
The E3 is a further development of the predecessor SoC R-Car D3 for 3D graphics clusters with improved rendering performance for 3D graphics. As usual in the R-Car family, the new SoC also offers functions for functional safety and security. These are important for networked vehicles, as the role of the human-machine interface (HMI) is becoming increasingly important.
Single-chip design allows the integration of a wide variety of systems. It thus significantly reduces the overall costs for system development and also achieves considerable space savings. R-Car E3 is just as scalable as the SoCs R-Car H3 and R-Car M3 for integrated cockpits and the R-Car D3 for instrument clusters, thus enabling maximum software reusability. Renesas partner companies with extensive experience in instrument clusters provide OS (Operating Systems) and HMI tools in addition to support for system integration. This reduces development effort and extends software support to a wide range of vehicles – from premium class with high-end 3D graphics to entry-level, where many insiders believe that integrated systems and full graphics will soon become the standard.
Product specs can be found here: https://www.renesas.com/eu/en/about/press-center/news/2018/10/20181017-r-car-e3-specs.pdf
More information on Renesas R-Car E3: https://www.renesas.com/eu/en/solutions/automotive/soc/r-car-e3.html