RAM Innovations joins Denchi and Prima

RAM Innovations joins Denchi and Prima

Business news |
By Nick Flaherty

Russel Industries has acquired RAM Innovations in north Wales, a bespoke R&D and manufacturing services provider specilaising in embedded die packaging.

The company joins contract manufacturer Prima Electronic Services as well as battery and energy storage specialist Denchi.

RAM has a comprehensively equipped facility with die placement/bonding, laser direct imaging, lamination, CNC machining and surface-mount technology (SMT) processing machinery, plus a wet chemistry development area that houses metallisation and chemical milling operations.

It carries out various embedded die packaging (EDP) activities including advanced sequential build-up processing techniques with wide bandgap technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN). This provides smaller footprint, better electromagnetic interference management, superior electrical connectivity for elevated switching speeds, as well as improved thermal conductivity.

RAM’s engineers are able to support customers’ product development projects – covering proof of concept, 3D modelling evaluation and thermal analysis, through to prototyping builds, product testing, micro-sectioning analysis and low-volume EDP manufacturing. With the support of Russel Industries, RAM will be able to take these projects all the way to high-volume production.The companies in the group are managed and operated according to the Mittelstand business model principles that emphasise customer focus, taking the long view, continuous improvement, investment in the workforce, lean structure, innovation, and social responsibility says Nick Russel, CEO of Russel Industries.

“We have been really impressed with the capabilities that the RAM team possess, and recognise that there is a huge opportunity to bring their embedded die packaging expertise to a wider audience,” said Russel. “By benefitting from the manufacturing strength that we have within the group, RAM will be better able to serve the needs of the wide bandgap community.”

“Though only a small operation, RAM has built up a strong reputation for providing superior semiconductor engineering,” said Geoff Haynes, Product Development Manager at RAM. “Now, by joining forces with Russel Industries, we will be able to scale up the production aspect of our business. This is certain unlock the full potential of our embedded die packaging technology in relation to next generation power module development within the electric vehicle and renewable energy sectors.”;;

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