Rapidus expands IBM deal to cover chiplet packaging
Rapidus has expanded its deal with IBM to cover chiplet packaging for the 2nm devices it plans to make in Japan.
Rapidus is building the first integrated fab and packaging plant, starting with 2nm process technology from IBM by 2027. The latest joint development partnership is aimed at establishing mass production technologies for chiplet packages using IBM packaging technology.
This agreement is part of a Japanese government project to quickly establish cutting-edge chiplet packaging technology.
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Over the years, IBM has accumulated R&D and manufacturing technologies for semiconductor packaging for high-performance computer systems. The company also has a wealth of experience with joint development partnerships with Japanese semiconductor manufacturers, as well as manufacturers of semiconductors, package manufacturing equipment, and materials. Rapidus also has a deal for packaging technology with Fraunhofer in Germany.
“Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology. We will make the most of this international collaboration and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain,” said Rapidus President and CEO Dr. Atsuyoshi Koike.
Darío Gil, SVP and Director of Research at IBM, said: “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce.”
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