Record fab capacity in 2025 with 17 new fabs
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The semiconductor industry is set to see a record silicon capacity with 17 new fabs in 2025 according to Knometa Research.
The slowdown in the market has pushed fab capacity out to 2025 with a record volume of of 23.1 million 200mm-equivalent wafers, says Konmeta.
Construction started in 2022 on many fabs originally scheduled to begin operations in 2024, but the market downturn that began that year caused the start date for some fabs to be pushed out to 2025. These will join many other fabs already scheduled to open during that year, resulting in record volume of capacity brought online in 2025 says Knometa.
- Semiconductor wafer capacity to hit all time high
- Analyst drops chip market forecast after 1Q24 “train wreck”
Following a sharp decline in chip unit shipments in 2023, unit growth is forecast to be about 11% in both 2024 and 2025.
According to the Global Wafer Capacity 2024 report from Knometa Research, the expansion of wafer capacity in 2024 is expected to be relatively low at 4% as manufacturers let capacity utilization rates recover from the low levels experienced in 2023.
The report shows that 23.1 million 200mm-equivalent wafers per year of fab capacity is projected to be put into production in 2025, surpassing the previous high of 18.5 million wafers in 2021. When expressed in 300mm wafer equivalents, there will be 10.3 million wafers per year of capacity brought online in 2025. In terms of growth rate, this is an 8% increase compared to the 2024 capacity level.
Knometa identifies 17 new fab lines for IC production are scheduled to begin operations in 2025:
- HH Grace – Wuxi, China – 300mm wafers for foundry services
- Intel – New Albany, Ohio, USA – 300mm wafers for adv. logic and foundry
- JS Foundry – Ojiya, Niigata, Japan – 200mm wafers for ICs (and discretes)
- Kioxia – Kitakami, Iwate, Japan – 300mm wafers for 3D NAND
- Micron – Boise, Idaho, USA – 300mm wafers for DRAM
- Pengxin Micro – Shenzhen, China – 300mm wafers for foundry
- Samsung – Pyeongtaek, S. Korea (P4 fab) – 300mm wafers for 3D NAND and DRAM
- SK Hynix – Dalian, China (Fab 68 expansion) – 300mm wafers for 3D NAND
- SMIC – Shanghai, China (SN2 fab) – 300mm wafers for foundry
- TI – Sherman, Texas, USA – 300mm wafers for analog and mixed-signal
- TSMC – Tainan, Taiwan (Fab 18, Phase 8) – 300mm wafers for foundry
- UMC – Singapore (Fab 12i, Phase 3) – 300mm wafers for foundry
The Global Wafer Capacity report provides a detailed examination of existing fab capacity along with a five-year forecast to 2027. The report has been published on an annual basis since 2007, initially by IC Insights. In December 2021, IC Insights transferred business associated with Global Wafer Capacity to Knometa.
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