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Redpine rolls flexible Wi-Fi chip set

Redpine rolls flexible Wi-Fi chip set

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By eeNews Europe



The simultaneous dual-band capability aims to protect high definition video streams from interference from data tasks such as Web access. The 3×3 MIMO family includes a baseband chip and two versions of an RF device, one with an integrated power amplifier. Together they deliver at least 300 Mbits/s at the TCP layer.

"Simultaneous dual-band provides the best approach to maintain high QoS for applications like wireless video distribution," said Flint Pulskamp, a research director at International Data Corp, speaking in a Redpine press release.

By adding a second or third baseband chip, engineers can create a system supporting 900 Mbits/s or 1.35 Gbits/s turbo rates. Redpine provides references designs for the turbo modes that use a single PCI Express host interface.

The chip set will sample in the fall with production in the first quarter of 2012 at prices less than $9 in volume. By about 2013, Redpine chief executive Venkat Mattela said the chips made in a 40nm TSM process could be offered for as little as $5 for the pair.

The company is also working on chips for the emerging 802.11ac Wi-Fi standard. The devices, targeted at handsets, could offer data rates approaching a Gbit/s at power consumption levels of 802.11n chips.

Mattela claims Redpine is the last remaining independent Wi-Fi chip developer with MIMO technology. Atheros is being acquired by Qualcomm,

So far, Intel, Marvell and Ralink have also shipped 802.11n chips supporting 3×3 MIMO.

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