Reinforced matrixed solder ensures consistent die-level bonding
The reinforced matrixed solder composite produces a high-reliability solder joint with increased thermal and mechanical performance for the development of new, or the improvement of existing, applications. The product now supports die-level bonding with a bondline of 50μm, increased lateral strength and excellent bondline co-planarity. The composite is available in ribbon and preforms.
Indium Corporation – www.indium.com