
Reinforced solder preforms increase bond line co-planarity
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By
Julien Happich
When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed 4x improved thermal cycling reliability compared to a solder preform-only approach and 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach. The reinforced solder preform also reduces voiding to less than 1%. As a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment.
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