MENU

Reinforced solder preforms increase bond line co-planarity

Reinforced solder preforms increase bond line co-planarity

New Products |
By Julien Happich



When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed 4x improved thermal cycling reliability compared to a solder preform-only approach  and 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach. The reinforced solder preform also reduces voiding to less than 1%. As a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment.

Visit Indium Corporation at www.indium.com

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News

Share:

Linked Articles
10s