Remtec expands process capabilities and technologies for metallized ceramic sensors
The company’s thick and thin film advanced ceramic metallization provides a versatile and cost effective answer for demanding applications focusing on a broad range of sensors and sensing related systems. To meet specific customer requirements, Remtec applies a variety of different technologies based on its core thick and thin film metallization, often combined with plating techniques.
Recognizing that the specifications for individual metalized ceramic sensors vary significantly by application, Remtec offers designers a number of interrelated metallization technologies including thick and thin films, PCTF® (Plated Copper over Thick/Thin films) and AgENIG® (Electroless Ni — Immersion Au over Thick film Ag).
Typical features of Remtec metallized ceramics include high density multilayer circuits (up to 6 metal layers), etchable thick films (50 µm line/spacing), plugged via holes with low dc resistance of 2 mΩ and wraparounds, leadless SMT connections and an infinite solder leach resistance.
In addition, Remtec’s metallized ceramics withstand continuous high temperature operation to 250°C, function in harsh and corrosive environments and are compatible with a variety of raw ceramic materials including Alumina, Beryllia, Aluminum Nitride, Zirconia, Barium Titanate and Silica.
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