Renesas MCUs for Bluetooth LE have on-chip antenna matching

Renesas MCUs for Bluetooth LE have on-chip antenna matching

New Products |
By eeNews Europe

Renesas’ wireless offering supports the Bluetooth Smart (Low Energy) wireless communication standard, with specific support for short-range/near field links. The RL78/G1D Group of microcontrollers (MCUs) has been developed by combining its low-power RF transceiver technology for Bluetooth Low Energy (BLE), with the company’s expertise on consumer and industrial MCUs, and on-chip peripheral devices necessary for wireless communication. By employing an evaluation kit and Bluetooth-SIG qualified protocol stack, the new MCUs enable system designers to conduct evaluation of wireless characteristics and initial evaluation of communication behaviours. The new MCUs are also provided with a PC GUI tool for easy manipulation of these components. These will enable engineers to develop Bluetooth Smart applications and reduce the time required for development while making effective use of development environment and software resources.

The Bluetooth Smart (BLE) compliant RL78/G1D MCUs have been developed by combining the ultra-low-power RL78 MCU, which has achieved widespread adoption in the consumer and industrial fields, with low-current-consumption Bluetooth low energy transceiver technology.

The current consumption of the RL78/G1D is among the lowest in the industry (3.5 mA during reception and 4.3 mA during transmission), delivering substantially reduced power consumption that is a key consideration for wireless devices. A newly added adaptable RF technology adjusts the power consumption during wireless operation to the optimal level to match the communication distance. This dramatically lowers the power consumption of near field wireless communication, and it is complemented by the on-chip integration of most elements required for the antenna connection, contributing to reduced external component costs.

Features of the RL78/G1D MCUs include;

– On-chip balun elements required for antenna connection simplify antenna connection circuit design. The RL78/G1D integrates on-chip the balun elements that otherwise would have to be provided in an external antenna connection circuit. This makes it possible simply to connect the RF transceiver signal terminals to the external antenna terminals without the need for discrete balun elements. This eliminates the need to perform repeated matching adjustment and evaluation on a balun circuit, thereby saving on development costs.

– Low current consumption for extended battery life. The newly developed low-current-consumption on-chip RF transceiver supports version 4.1 of the Bluetooth Core Specification and enables wireless operation at among the lowest power consumption levels in the industry (3.5 mA during reception and 4.3 mA during transmission, at 0 dBm). This, combined with the power efficiency of the RL78 family of ultra-low-power MCUs, makes for extended battery life. For example, when wireless communication takes place at one-second intervals while maintaining a connected state with another wireless device, the BLE functionality can be added with average current of 10 µA.

– Function that automatically optimises power consumption during wireless operation to match communication conditions. Built-in adaptable RF functionality optimises the power consumption during wireless operation to match the communication distance. This prevents more power than necessary from being used, especially during near field communication. By using this function, under communication conditions where the wireless devices are located approximately 1 metre apart (varies according to the connection status) and when the frequency of wireless operation is raised in order to prioritise data transfer, it is possible to boost power efficiency.

Renesas positions the new RL78/G1D as a product that contributes to the near field wireless communication market, which is expected to grow with the coming of a more energy-efficient “smart society” and IoT.

The new RL78/G1D Group comprises six product versions – 256, 192 & 128 kB on-chip flash memory options and industrial or consumer grade for each memory option. Samples are available now.


If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News


Linked Articles