Renesas to close Tokyo Device Division due to market pressures from Asia
Volume production will be transferred to other Renesas manufacturing sites, while some products will be discontinued. The company also plans to accumulate excess production by front-loading the production schedule for those products that require time to shift production to alternate sites.
The facility is expected to close towards the end of March 2012. The closure forms part of the company’s 100-day project announced in July 2010, which called for improved efficiency through expansion of overseas business and production concentration.
The facility specialises in the assembly and test of transistors, analogue ICs, LCD drivers and memory devices. Its semiconductor assembly operations focus on large-capacity memory products employing multilayer chip-stacking technology and single-wafer testing technology.