Report: IBM plans US$730 million Canadian chip expansion
IBM Corp. plans to spend CA$1 billion (about US$730 million) upgrading and expanding its assembly, testing and packaging (ATP) facility at Bromont, Canada, according to a Bloomberg report.
The move will likely introduce chiplet on interposer assembly which is likely to become a standardized way of assembling system-level components.
The investment will be rolled out in a number of phases over the next five years, the report said. IBM employees about 1,000 people on the 800-acre site. The IBM Canada plant in Bromont, Quebec, is one of the largest chip assembly and test facilities in North America.
IBM has just announced a first phase partnership with the Government of Canada, and the Government of Quebec to invest CA$187 million (about US$137 million) to advance R&D at the facility.
“IBM has long been a leader in semiconductor research and development, pioneering breakthroughs to meet tomorrow’s challenges. With the demand for compute surging in the age of AI, advanced packaging and chiplet technology is becoming critical for the acceleration of AI workloads,” said Darío Gil, IBM senior vice president and director of research, in a statement issued by IBM. “As one of the largest chip assembly and testing facilities in North America, IBM’s Bromont facility will play a central role in this future. We are proud to be working with the governments of Canada and Quebec toward those goals and to build a stronger and more balanced semiconductor ecosystem in North America and beyond.”
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