Report: Intel interested in setting up Indian wafer fab
The new unit could be set up for the development and fabrication of test chips on Intel’s 18A (18 angstrom or 1.8nm) manufacturing process, the publication said quoting unnamed sources.
The report came after an exchange of Twitter messages between Randhir Thakur, a senior vice-president and president of Intel Foundry Services, and Ashwini Vaishnaw, Minister for Electronics and Information Technology in the central Indian government.
Vaishnaw tweeted: “Intel – welcome to India” in response to Thakur who had tweeted congratulating the ministry on the setting up of the incentive scheme (see India details wafer fab subsidy scheme favoring 28nm). “Glad to see a plan laid out for all aspects of the supply chain: talent, design, manufacturing, test, packaging and logistics,” Thakur had tweeted.
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