Rogers to show advanced circuit materials at IMS 2013
Rogers will show their next generation RO4000® circuit materials, notably RO4835™ high frequency laminates. These materials are specially formulated with enhanced oxidation resistance for applications requiring outstanding electrical stability over time and temperature, while maintaining the cost advantages of standard thermoset materials. In fact, low-loss circuits on RO4835 laminates can be fabricated using standard processes used for epoxy/glass (FR-4) circuit materials.
Just as with Rogers RO4350B™ circuit materials, RO4835 laminates offer a dielectric constant of 3.48 and a low loss tangent of 0.0037 at 10 GHz, plus a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions. These improved oxidation resistant circuit materials exhibit x- and y-axis expansion coefficients similar to those of copper, for excellent dimensional stability. RO4835 laminates are RoHS-compliant and do not require special preparation, minimizing production costs.
The company’s latest PCB material, RO4360G2™ laminate, features an improved relative temperature index (RTI) for a higher UL maximum operating temperature (MOT), and exhibit a dielectric constant of 6.15 at 10 GHz. These glass-reinforced, ceramic-filled thermoset laminates offer the ideal balance of performance and processing ease. They are RoHS compliant and compatible with lead-free processing methods; in fact, they can be processed with the same methods as for FR-4 to minimize production costs. RO4360G2 laminates feature low loss and low z-axis CTE, with characteristics well suited for demanding RF/microwave circuits, such as amplifiers.
www.rogerscorp.com
www.ims2013.org
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
