Rogers to showcase high performance circuit materials at IMS2016
Rogers offers a variety of material options that are specifically engineered to help manage the thermal challenges that today’s RF engineers face. From PTFE based RT/duroid® 6035HTC, TC350™, and TC600™ laminates to thermoset materials 92ML™ laminates and 92ML StaCool™ laminates, Rogers provides a large toolbox that offers many viable options.
RT/duroid 6035HTC laminates offer the highest performance available with a thermal conductivity of 1.44 W/mK in combination with a super low loss of 0.0013 at 10 GHz. TC350 and TC600 laminates offer an excellent combination of thermal conductivity (1.0-1.1 W/mK), low loss (0.0020 at 10 GHz), and cost effectiveness.
The 92ML Series™ materials offer extreme thermal management in a lower cost modified epoxy based thermoset system with a high thermal conductivity (2.0 W/mK), high Tg (160°C), and halogen free flame retardancy. The 92ML StaCool laminates are an Insulated Metal Substrate (IMS) version of the 92ML series laminate to enable the highest heat dissipation configuration available.
Rogers also offers COOLSPAN® TECA adhesive as an option for designers to use when bonding heat sinks to board materials. COOLSPAN TECA modified epoxy assembly adhesive has a thermal conductivity of 6 W/mK in a lead free capable, thermally stable system.
RO4835™ laminates, with a dielectric loss tangent of 0.0037 at 10 GHz, are now available with Rogers proprietary LoPro® reverse treat copper foil. These materials are ideal for applications requiring low insertion loss characteristics. LoPro foil provides reduced electrical variability due to its smoother copper surface, maintaining consistent performance for reliable broadband signal delivery from Digital through RF and microwave frequencies. In addition, RO4835 laminates provide ten times improved oxidation resistance compared to RO4350B™ laminates.
Further, as part of the MicroApps Session, John Coonrod, Technical Marketing Manager at Rogers, will lead two presentations on the proper selection of circuit materials for microwave frequencies and beyond.
The first presentation, “High Frequency Circuits Which Bend and Flex” will cover incorporating flexible circuit materials into next generation RF/microwave. The second presentation, “Circuit Material Selection for Millimeter-Wave Applications” targets attendees interested in serving the growing demand for millimeter-wave circuits in such applications as automotive safety systems and Fifth Generation (5G) wireless systems.
As a founding member of the RF Energy Alliance, Rogers Corporation joined with a group of like-minded companies dedicated to realizing solid-state RF energy’s true potential as a clean, highly efficient and controllable heat and power source. Learn how The Alliance aims to reduce system cost and increase market adoption and growth through standardization of solid-state RF energy components, modules and application interfaces. Dr. Klaus Werner, Executive Director of RF Energy Alliance, will be available at the Rogers booth on Wednesday, May 25th, at 1PM to discuss this technology.
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