Rohm develops its first silicon capacitor

Rohm develops its first silicon capacitor

Technology News |
By Nick Flaherty

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Rohm has developed its first silicon capacitor range in the smallest 01005 surface mount package for smartphones and wearable devices, IoT devices and optical transceivers.

The first series in the silicon capacitor range, the BTD1RVFL series (BTD1RVFL102 / BTD1RVFL471) consists of the industry’s smallest 01005-size (0.1inch × 0.05inch) / 0402-size (0.4mm × 0.2mm) mass-produced surface mount device.

Silicon capacitors using thin-film semiconductor technology can provide higher capacitance in a thinner form factor than existing multilayer ceramic capacitors (MLCCs). Stable temperature characteristics, along with better reliability, are accelerating the adoption in a variety of applications.

The silicon capacitors are manufactured using Rohm’s proprietary RASMID miniaturization technology that allows processing in 1µm increments. This eliminates chipping during external formation and improves dimensional tolerances within ±10µm. This small variation in product size enables mounting with a narrower distance between adjacent components. At the same time, the backside electrode used for bonding to the substrate has been expanded to the periphery of the package to improve mounting strength.

This reduces the mounting area by approximately 55% over general 0201-size (0.2inch × 0.1inch) / 0603-size (0.6mm × 0.3mm) products to just 0.08mm2. A built-in TVS protection element ensures high ESD resistance that minimizes the time required for surge countermeasures and other circuit design elements.

Rohm expects the global market for silicon capacitors to grow by 50% by 2030 to (Y) 300bn ($2bn). It plans on developing a second series in 2024 improving the high-frequency characteristics for communication equipment, as well as products for servers and other industrial equipment.

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