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Rugged embedded module hosts Intel Apollo Lake cpu

Rugged embedded module hosts Intel Apollo Lake cpu

New Products |
By Graham Prophet



The combination of soldered 4/8 GB Dual Channel DDR3L storage, ECC, an extended temperature range specification, optimized cooling solutions and optional conformal coating open up potential applications for the module in extreme environmental conditions.

 

The carrier board offers broad capabilities for expansions and auxiliary functions, because of the processor’s maximum utilization of interfaces, such as eight USB ports – including two USB 3.0 ports – as well as up to four PCIe lanes. Equipped with the latest Intel graphics processor core, the module offers 4K screen resolution for three different screen contents, 3D video processing and significantly enhanced video encoding/decoding performance.

 

There is optional eMMC flash memory and installed component options for either an embedded display port (eDP) or LVDS and TPM.

 

Time Coordinated Computing, virtualization and other new functions give users opportunities for real-time applications and time-synchronous IoT solutions. The integrated on-board controller supports thermal management, a multi-stage watchdog and ‘Green ECO-Off’ mode for minimal standby consumption. It also gives users configuration options (flexiCFG) for a high degree of flexibility.

 

TQ Group; www.tq-group.com/en/TQMxE39C1

 

 

 

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