Samsung improves interposer-based packaging

Samsung improves interposer-based packaging

Technology News |
By Peter Clarke

Samsung’s I-Cube integration technology places one or more logic dies and several High Bandwidth Memory (HBM) dies on top of a silicon interposer to support multi-die packaging.

I-Cube4 incorporates four HBMs and one logic die and is the successor to I-Cube2. Applications are expected within high-performance computing (HPC), AI, 5G, cloud and large data center applications.

The use of a larger interposer to accommodate more die has led to potential problems with interposer warpage due to localized heating of active chips. Samsung has responded by making changes to the interposer material and thickness. Additionally, Samsung has developed a mold-free structure for I-Cube4 to remove heat and enhance manufacturing yield by conducting a pre-screening test that can filter out defective products during the fabrication process.

The I-Cube2 process was launched in 2018 followed by  eXtended-Cube (X-Cube) in 2020.

Samsung is developing more advanced packaging technologies including I-Cube6 and higher by using a combination of advanced process nodes, high speed interface IPs and advanced 2.5/3D packaging technologies.

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