Samsung is running 28nm FDSOI chip process, cites IoT as driver
The report is in the form of an interview with Kelvin Low, senior director of marketing for Samsung Foundry and Axel Foscher, director of Samsung System LSI business in Europe. Soitec SA, the manufacturer of SOI wafers used in FDSOI production, is the publisher of Advanced Substrate News.
Low says that during 2015 Samsung has run a couple of multi-project wafer (MPW) shuttles with more scheduled for 2016 and created physical design kits (PDKs) and platform of intellectual property cores that are available now.
Low does not identify customers beyond ST and Freescale but says there are more customers operating in "all the market segments, especially IoT, where the cost and ultra-low power combination is a very powerful one." FDSOI chips are expected to be in consumer electronics in 2016 but to find them in sectors such as communications infrastructure, networking and automotive will take longer because of the more arduous qualification requirements, said Low.
"Everyone’s waiting for Chipworks or TechInsights to cut away an end-product device that has FDSOI. It’s just a matter of time," he is quoted saying.
Meanwhile Globalfoundries is running about a year behind Samsung with its own manufacturing process with a nominal 22nm minimum geometry design rule and that can operate down to 0.4V.
Related links and articles
Advanced Substrate News article
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