Samsung signs to use YMTC NAND flash technology
Samsung Electronics is set to use bonding technology from China’s YMTC for the production of 400-layer NAND flash memory, according to Korea’s ChosunBiz news site.
A contract was signed between the two companies on Monday 24 February, ChosunBiz reports referencing unnamed industry sources. The account added that hybrid bonding is now expected to be essential to get to and beyond 400 layers in 3D NAND flash. This shows how rapid the progress China has made in memory making technology.
However, it may also reflect that a US-China trade war may impact YMTC’s ability to sell memory components outside China and that a licensing or cross-licensing arrangement for various technologies could benefit YMTC.
Hybrid bonding is a process that stacks chips using copper without ‘bumps’ and that therefore allows reduced chip sizes while improving performance. It is thought that this describes the ‘Xtacking’ approach introduced by YMTC when it entered the 3D-NAND market.
‘Xtacking’ approach offers faster 3D-NAND, claims Yangtze
YMTC is far behind Samsung and SK Hynix in terms of market share but is on parity with these companies in terms of the level of 3D-NAND stacking and memory density achieved. Samsung has opted to license the technology to avoid the possibility of patent disputes as stacks go to 400 layers and beyond.
Related links and articles:
News articles:
China’s YMTC confirms lead in 3D NAND flash memory
‘Xtacking’ approach offers faster 3D-NAND, claims Yangtze
China’s YMTC sues Micron over 3D-NAND patents
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