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Samsung tips plans for 14 angstrom process

Technology News |
By Peter Clarke


Samsung is planning to follow mass production of its 2nm process in 2025 with a 1.4nm process in 2027, the company announced at its annual Samsung Foundry Forum event held in San Jose, California.

Over the same period Samsung said it would triple output of its advanced process technologies.

The company said demand is being driven by high-performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications.

“The technology development goal down to 1.4nm and foundry platforms specialized for each application, together with stable supply through consistent investment are all part of Samsung’s strategies to secure customers’ trust and support their success,” said Si-young Choi, president of the foundry business unit at Samsung Electronics, in a statement.

Samsung is currently mass producing its 3nm gate-all-around (GAA) manufacturing process having beaten rival foundry TSMC to first-to-market bragging rights in June (see Samsung starts 3nm chip production ahead of TSMC). Samsung will be further enhancing its GAA technology and plans to introduce the 2nm process in 2025 and 1.4nm process in 2027.

Intel plans to introduce an 18 angstrom process (1.8nm) in 2025 but direct comparisons are not easily possible.

Chiplet

At the same time Samsung will accelerate the development of 2.5D/3D heterogeneous integration packaging technology. Samsung’s X-Cube with micro-bump interconnection will be ready for mass production in 2024, and bump-less X-Cube will be available in 2026, the company said.

HPC, 5G and automotive circuits are expected to be more than 50 percent of Samsung Foundry’s output by 2027 and Samsung will provide tailored support for each domain.

In the automotive sector Samsung already provides embedded non-volatile memory on 28nm and will be 14nm eNVM in 2024 followed by 8nm at an unspecified time. Samsung did not say which particular eNVM technology it would use. Embedded MRAM and embedded ReRAM are both possibilities. For wireless applications Samsung has been mass producing 8nm RF and 5nm RF is currently in development.

Related links and articles:

www.samsung.com

News articles:

Samsung starts 3nm chip production ahead of TSMC

Intel renames manufacturing nodes, tips RibbonFET, PowerVia

TSMC shows 2nm nanosheet transistor plans for 2025 production

Intel catching up with TSMC?

 


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