The plan for a fab in Austin, Texas, follows the move by TSMC to build a 5nm wafer fab in Phoenix, Arizona with US government support.

Samsung bought land in 2020 and recently applied for planning permission. The plan calls for construction of the shell to start this year with production of wafers to begin in 2023. That would be on a similar time-line or even slightly ahead of that of TSMC.

In May of 2020 that Intel was reported to be in discussions with the US Department of Defense and that TSMC was in discussions with the US Department of Commerce and that Samsung was also being approached about expanding its presence in Austin.

The moves are part of a coordinated initiative to re-inforce chip manufacturing in the US for strategic reasons, and are perhaps driven by the current shortages of foundry capacity.

Related links and articles:

Other articles on eeNews Europe

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News


Linked Articles