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Samsung’s EUV fab is in 7nm mass production

Business news |
By Peter Clarke

The fab is Samsung’s first dedicated to extreme ultraviolet lithography production and is being used to produce chips with 7nm process and below. The facility is expected to provide manufacturing for nodes down to 3nm. The company said it will ship both 7nm and 6nm chips to customers in 1Q20 and that as production ramps up it will triple EUV manufacturing capacity by the end of 2020.

Initial production of the 7LLP process began at the S3 wafer fab, also in Hwaseong, late in 2018. Samsung broke ground on the V1 wafer fab in February 2018 and began production of test wafers in the 2H19. By the end of 2020 the total investment in the V1 line will have reached $6 billion, Samsung said.

With the introduction of the V1 line Samsung Foundry has six wafer fabs in operation at sites in South Korea and the United States. Five are manufacturing with 300mm-diameter wafers and one using 200mm wafers.

Related links and articles:

www.samsung.com

News articles:

Samsung launches 7nm EUV process, SAFE partnership

Samsung early with 7nm process, says report

Samsung wins (some) 5nm business from Qualcomm

Did chip production leadership boost TSMC’s January sales?

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