Scrona teams for digital ink
Swiss MEMS print head developer Scrona is working with Electroninks on metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging.
The two will partner on process development, optimizing the use of Electroninks digital ink materials within the Scrona MEMS-based print head technology for semiconductor applicatiions. Joint research and development will take place in Scrona’s Zürich application lab and in a regional technology centre in Taiwan.
The Electroninks metal complex inks – including silver, gold, platinum, nickel and copper – are used for printed circuit board (PCB) manufacturing, semiconductor packaging, consumer electronics, wearables, medical devices and more.
“This alliance between Scrona and Electroninks will accelerate innovation in semiconductor manufacturing by pushing the boundaries of what’s possible in packaging in target applications such as RDL repair and fine line metalization, via filling and 3D interconnects,” said Patrick Heissler, CEO of Scrona. “Our R&D efforts and process development can help meet the growing demand for higher performance, device miniaturization and reliability. “
“By working together, our companies can drive the commercialization of advanced semiconductor packaging processes that utilize cutting-edge EHD print head technology,” said Melbs LeMieux, cofounder and president of Electroninks. “This will allow our customers to better adopt fine line print/repair, and RDL metallization solutions, thereby enabling the integration of complex functionalities into compact semiconductor packages.”
Scrona is developing multi-nozzle MEMS print heads that can be used for digital ink printing of semiconductors and microLED displays.
www.Scrona.com; www.Electroninks.com
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