
Seco in Italy has had early access to MediaTek’s Genio family of AI System-on-Chips (SoCs) devices for two IoT System-on-Modules (SoM).
The Seco SOM-SMARC-Genio700 and SOM-SMARC-Genio510 allow developers to quickly incorporate the latest SoCs from MediaTek using the SMARC standard.
The MediaTek Genio series includes AI-capable chipsets for a wide range of IoT devices, from smart home appliances and industrial automation to connected healthcare.
The Genio 700 uses two ARM Cortex-A78 cores and six ARM Cortex-A55 cores with a Tensilica VP6 and a MediaTek APU3.0 AI processors delivering up to 4 TOPS. The integrated Mali-G57 MC3 GPU supports high-quality graphics and multiple display outputs via LVDS, eDP, HDMI®, and DP interfaces.
The Genio 510 SoC also has two ARM Cortex-A78 cores but with four ARM Cortex-A55 cores, with an embedded AI engine delivering up to 2.8 TOPs. The Mali-G57 MC2 GPU supports 4K60 + FHD60 displays. Pin-to-pin compatibility with the Genio700 processor allows for easy performance upgrades without the need for redesign, accommodating greater workloads as required.
The SOM-SMARC-Genio700 and SOM-SMARC-Genio510 from SECO integrate these processors into compact, SMARC 2.1.1 standard modules designed for low-power industrial IoT applications requiring advanced connectivity, real-time processing, AI capabilities, and reduced power consumption.
The Genio700 SMARC has up to 8 GB of soldered-down LPDDR4X-3733 DRAM memory.
MediaTek’s dynamic resource allocation technology ensures optimal power efficiency when executing AI-driven applications and multimedia tasks. Dedicated AI processing units enable complex AI functions, while robust graphic capabilities allow for high-resolution, smooth visual displays. Support for the latest wireless standard, including Wi-Fi/BT options, ensures reliable and fast connectivity for IoT devices.
“SECO is thrilled to collaborate with MediaTek to bring cutting-edge innovations to the industrial IoT landscape. Our SOM-SMARC-Genio700 and SOM-SMARC-Genio510 modules leverage the advanced capabilities of MediaTek’s Genio series to offer unparalleled performance, efficiency, and connectivity. This collaboration embodies SECO’s commitment to delivering robust, low-power solutions that meet the evolving needs of our customers across various industries. By integrating MediaTek’s AI-capable SoCs, we empower our clients to manage new services with the possibility of processing data on the device and managing new interfaces based on 4K display and smooth interaction”, stated Maurizio Caporali, Chief Product Officer at SECO.
“Leveraging the AI-enabled MediaTek Genio 700 and Genio 510 chipsets, we are working closely with SECO on a wide array of embedded solutions,” said CK Wang, General Manager of the IoT business unit at MediaTek. “Through a combination of performance, power efficiency, and premium connectivity, our MediaTek Genio chips are aiding customers in developing products that are capable of enhancing the Industrial IoT landscape.”
Both modules offer various configurations to withstand diverse environmental conditions and meet heterogeneous needs, from mobile-connecte applications to challenging industrial environments.
They are also ready for integration with Clea and primed for use with SECO’s software suite. Clea enhances the hardware infrastructure with a series of value-added services encompassing device management, remote updates, and data pipeline management, all while ensuring top-tier security standards.
