Security IP for die-to-die communication between chiplets
The Fortrix SecureD2D IP solution enables secure data exchange between different chiplets within a Heterogenous System on Chip (HSoC). It offers secure authentication and firmware boot/code load between chiplets, providing assurance for each chiplet within the HSoC.
The IP was selected and deployed as part of the Department of Defense State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program and has already been adopted by Lockheed Martin and a world-leading semiconductor company, says the company. The Fortrix SecureD2D IP consists of a controller communicating over a secure fabric to hardware-based crypto accelerators which perform rapid encryption and decryption to enable cryptographic functions such as ECDSA, SHA2, AES, and others.
A low-level firmware API and a customizable high-level application are also part of the IP package to allow rapid integration into secure chiplets. The IP implements both leader and follower termination points.
“The Fortrix SecureD2D IP enables highly-secure die-to-die communications between chiplets, paving the way for the Department of Defense to streamline the design process and lower the cost of developing chiplet systems,” says Mark Beal, CTO of the Intrinsix Business Unit at CEVA. “We’re pleased to make this IP available within the DoD SHIP program and we look forward to helping secure the next-generation of HSoC devices.”
Fortrix SecureD2D IP is available for licensing today. Deliveries include RTL, SDC constraints, firmware and documentation; and the IP is suitable for any semiconductor process. The company also provides further design services to help integrate and support the security IP and chiplet development in addition to full HSoC design and delivery.