SEMI announces speaker line up for MEMS summit

SEMI announces speaker line up for MEMS summit

Business news |
By Peter Clarke

  • Amkor  – A. Arcedera, VP MEMS
  • Bosch Automotive – J. Stadler, SVP & Head of Sensors
  • Bosch Sensortec – U. Gomez, CTO
  • Globalfoundries – R. Kumar, Senior Director MEMS
  • IHS  – J. Bouchaud, Director and Senior Principal Analyst MEMS & Sensors
  • Intel – R. Baskaran, Senior Technologist
  • Qorvo – R. Aigner, Senior Director R&D Acoustic Technology
  • NXP Semiconductors – J. Weyer, VP Automotive Sales EMEA
  • Roland Berger GmbH – Michael Alexander, Partner
  • STMicroelectronics – B. Vigna, EVP GM, Analog and MEMS Group
  • STMicroelectronics – A Onetti, GM Volume MEMS & Analog Division
  • Teledyne DALSA – C. Jean, EVP & GM Foundry Operation
  • Yole Developpement – E. Mounier, Senior Analyst MEMS

The conference program is developed by a steering committee composed of executives from ASE, Bosch, Bosch Sensortec, CEA-Leti, EV Group, Fraunhofer ENAS, Fraunhofer IZM, IHS, NXP, Okmetic, Sencio, SPTS, STMicroelectronics, SUSS MicroTec, X-Fab, and Yole Developpement. SEMI is operating a system of “early-bird” registration that is open until May 31.

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