SEMI announces speaker line up for MEMS summit
Business news
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By
Peter Clarke
- Amkor – A. Arcedera, VP MEMS
- Bosch Automotive – J. Stadler, SVP & Head of Sensors
- Bosch Sensortec – U. Gomez, CTO
- Globalfoundries – R. Kumar, Senior Director MEMS
- IHS – J. Bouchaud, Director and Senior Principal Analyst MEMS & Sensors
- Intel – R. Baskaran, Senior Technologist
- Qorvo – R. Aigner, Senior Director R&D Acoustic Technology
- NXP Semiconductors – J. Weyer, VP Automotive Sales EMEA
- Roland Berger GmbH – Michael Alexander, Partner
- STMicroelectronics – B. Vigna, EVP GM, Analog and MEMS Group
- STMicroelectronics – A Onetti, GM Volume MEMS & Analog Division
- Teledyne DALSA – C. Jean, EVP & GM Foundry Operation
- Yole Developpement – E. Mounier, Senior Analyst MEMS
The conference program is developed by a steering committee composed of executives from ASE, Bosch, Bosch Sensortec, CEA-Leti, EV Group, Fraunhofer ENAS, Fraunhofer IZM, IHS, NXP, Okmetic, Sencio, SPTS, STMicroelectronics, SUSS MicroTec, X-Fab, and Yole Developpement. SEMI is operating a system of “early-bird” registration that is open until May 31.
Related links and articles:
www.semi.org/EuropeanMEMSSummit
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