Semtech targets AI data centres with 3.2T connectivity
Semtech Corporation has expanded its optical communications portfolio to support various generations of data centre connectivity with 400G per channel technology for 3.2T modules in active development. The innovations address increasing demands for higher speed, processing power, and data throughput, driven by machine learning, LLMs, and AI clusters.
In response to the industry’s shift toward higher bandwidth density, 200G per channel FiberEdge physical medium-dependent (PMD) ICs deliver outstanding performance, featuring best-in-class bandwidth, noise, and driver output swing, along with exceptional linearity and low distortion. The 200G FiberEdge technology enables the development of future 800G and 1.6T modules while also addressing crucial power efficiency and space requirements. Furthermore, the company has heightened its investments in innovative 400G per channel technology, paving the way for next-generation 3.2T connectivity modules.
200G per channel PMD offerings are now available to enable the next wave of 1.6T optical connectivity module deployments essential for scaling AI training clusters, including 112 GBd PAM4 transimpedance amplifiers (TIAs) and 112 GBd PAM4 laser drivers.
“The path to 3.2T connectivity requires overcoming significant technical barriers in both speed and power efficiency,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “Our 200G and 400G per channel innovations represent critical building blocks that enable the next generation of data centre fabric. As AI models continue to grow exponentially in size and complexity, these architectural advances will help hyperscalers build the infrastructure foundation needed for tomorrow’s AI workloads while managing their data centre power envelope.”
400G per channel technology is in active development with samples available to select customers.
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