Showa Denko in Japan has launched mass production of 150mm (6in) silicon carbide (SiC) single crystal wafers for power devices.
SiC power semiconductors have excellent heat-resisting property and high withstanding voltage for electric vehicles trains and industrial equipment, but many are still on 4in wafers. However the race is on to produce 200mm (8in) SiC wafers in volume.
- STMicroelectronics produces its first 200mm SiC wafers
- Bosch looks to 200mm SiC wafers with expansion
Showa Denko is already the leading supplier of SiC epitaxial wafers, and has a number of key supply contracts for the wafers, including Infineon Technologies and Toshiba.
Related SiC articles
- Showa Denko signs long term SiC deal with Toshiba
- Infineon signs Japanese SiC wafer deal
- Infineon buys Siltectra to boost silicon carbide production
- Infineon signs five year deal for SiC materials
In 2018, Showa Denko took over SiC-wafer related assets of Nippon Steel & Sumitomo Metal Group (now the Nippon Steel Group) and has been developing technologies for mass production of SiC wafers since then. It was also part of a key Japanese government project that started in 2010 to develop the technology.
Showa Denko says it will continue purchasing SiC wafers from the existing partners in order to respond to rapidly growing demand for SiC epitaxial wafers for power semiconductors. This diversity of sources of SiC wafers establishes a stable supply chain for SiC epitaxial wafers. This is a key requirement for volume production of SiC power devices,
II-VI has also been expanding its production of SiC wafers in Sweden after the acquisition of Ascatron.
As well as using Showa Denko as a supplier, Infineon is using GTAT in the US as a supplier for SiC boules, although GTAT is now part of on semiconductor.
Other SiC articles
- UK SiC substrate pilot line boost
- SiC boost for Bosch
- Bosch leads project to create an independent SiC supply
- II-VI expands SiC wafer factories in Sweden, US
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