Siemens EDA certifies Calibre, FastSPICE for TSMC 2nm

Siemens EDA certifies Calibre, FastSPICE for TSMC 2nm

Technology News |
By Nick Flaherty

Siemens EDA has certified its Calibre nmPlatform verification and FastSPICE tools for the N2 2nm process technology from TSMC.

This is a move to a different type of transistor structure and includes the nmDRC design rule checking software, YieldEnhancer, PERC, xACT and nmLVS tools. These are also ported to the latest 3nm N3E process technology.

TSMC and Siemens have also collaborated to certify Siemens’ mPower transistor-level electromigration and IR drop (EM/IR) sign-off tool for the N3E process for EM/IR signoff. The two are  are now collaborating to certify the mPower digital software for N3E.

New certifications for Analog FastSPICE platform

Siemens’ Analog FastSPICE platform for circuit verification of nanometer analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits has successfully achieved TSMC certification for the N5A, N3E, and N2 processes.

As part of the custom design reference flow (CDRF) for TSMC’s N3E and N4P processes, Siemens’ Analog FastSPICE platform now supports TSMC’s Reliability Aware Simulation technology, which addresses IC aging and real-time self-heating effects among other advanced reliability features. TSMC’s N4P CDRF also includes Siemens’ Solido Variation Designer software for advanced variation-aware verification at high sigma.

New certification for Tanner software

Siemens has also enhanced its Tanner software, which helps customers design and lay out their next-generation analog, mixed-signal and MEMS chips. This now works with designs on TSMC’s 16nm node. This is part of an ongoing programme to massively transform the Tanner portfolio into an enterprise-ready design environment with the ability to support advanced process nodes. Part of this effort includes Siemens’ close collaboration with TSMC on many initiatives, including the establishment of Tanner software iPDK support for legacy nodes, and emerging support for advanced nodes.

“We are excited that our partnership with TSMC is offering innovative new solutions that enable success for our customers,” said Joe Sawicki, EVP of IC EDA at Siemens Digital Industries Software. “These new certifications and milestones further demonstrate our commitment to driving digital transformation in the semiconductor industry with our longtime foundry partner TSMC.”

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