Siemens is first major EDA supplier to DARPA Toolbox
The Toolbox Initiative from the US Department of Defense’s research and development agency provides developer with low cost, scalable access to state-of-the-art tools and intellectual property (IP) under predictable legal terms and streamlined acquisition procedures.
The aim is to reduce performer reliance on low-quality, low-cost tools and IP that increase execution risks and complicate post-DARPA transitions.
Other specialist EDA suppliers to the Toolbox are Ansys for mechanical engineering simulation as well as fluid dynamics, electromagnetic, semiconductor, optics, materials and embedded software, and HDL compiler module supplier Verific Design Automation. Other European IP suppliers to the Toolbox include ARM, Ceva and Accelercom.
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Advanced defence applications increasingly require custom silicon to meet very specific requirements, and Siemens EDA software is expected to play a key role in the Toolbox. This allows DARPA vendors access to select packages of Siemens EDA tools and technologies throughout the life of their contractual relationship with the agency. This will enable innovative companies to use Siemens EDA tools for the development of advanced analog, digital, and mixed signal ICs, silicon photonic ICs as well as advanced packaging and printed circuit boards targeting bleeding-edge applications.
“We have expanded our EDA product lineup to now include world-class place-and-route, IC desktop prototyping, IP verification and silicon lifecycle solutions technologies,” said Mike Ellow, Executive Vice President, Siemens EDA, Go-to-Market and Sales, Services & Customer Success. “Siemens looks forward to further engaging with DARPA and its Toolbox community to help unleash innovation and enable groundbreaking new IC designs.”
www.darpa.mil/work-with-us/darpa-toolbox-initiative
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