Silicon capacitor has 1pH ESL for AI chips
Empower Semiconductor has developed a 16.6uF silicon capacitor for embedding into any SoC substrate or interposer.
The 16.6uF EC1005P silicon capacitor is the largest from Empower and has an equivalent series inductance (ESL) of just 1pH. This makes it suitable for embedded into a substrate or interposer that hosts a high current system on chip (SoC) or chiplet designs for AI applications.
The EC1005P ECAP uses the Empower high-performance and high-density silicon capacitor technology for the ‘last inch’ decoupling gap from the voltage regulators to the SoC supply pins. This substitutes several discrete components with much lower performance and larger footprint with a single monolithic device that provides optimal electrical performance and simplifies engineering complexity.
As well as an ESL of 1pH, the EC1005P silicon capacitor has an equivalent series resistance (ESR) of 3mΩ in a 3.643 x 3.036mm, 120-pad chip-scale package (CSP).
The device comes in a standard profile of 784 microns that can be customized for various height requirements and using a silicon approach means it provides high stability over voltage and temperature and are not subject to derating or aging like traditional multi-layer ceramic capacitors (MLCCs).
“The performance of SoCs and other large computing processors are constantly increasing,” said Mukund Krishna, senior manager of product marketing, Empower Semiconductor. “It is becoming increasingly difficult to reach the level of power integrity and voltage regulation that these devices require with conventional MLCCs. The EC1005P features close-to-ideal parasitic parameters, allowing these SoCs to operate with reduced voltage margining and ultimately reducing system power.”
The EC1005P ECAP silicon capacitor is available for sampling now and will be in volume production in Q4 2024.
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